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Infineon acquires Siltectra, a specialist for silicon carbide

Munich and Dresden, Germany – 12 November 2018 – Infineon Technologies AG (FSE: IFX / OTCQX: IFNNY) acquires Siltectra GmbH, a start-up based in Dresden. The start-up has developed an innovative technology (Cold Split) to process crystal material efficiently and with minimal loss of material. Infineon will use the Cold Split technology to split silicon carbide (SiC) wafers, thus doubling the number of chips out of one wafer. A purchase price of 124 million Euros was agreed on with the venture capital investor MIG Fonds, the main shareholder.

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Following a successful 2018 fiscal year Infineon confirms its targets for revenue, Segment Result and investments that were raised in June. Further dividend increase planned

Neubiberg, Germany, 12 November 2018 – Infineon Technologies AG today reported results for the fourth quarter of its 2018 fiscal year (period ended 30 September 2018).

“The fourth quarter was a strong finish to an outstanding fiscal year. For the first time, our current business segments have gener…

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