「GLOBALFOUNDRIES」カテゴリーアーカイブ

We have just taped out our second 22nm chip called Kosmodrom in collaboration with @GLOBALFOUNDRIES. It has two independent Ariane cores (RV64ICMFD) optimized for different operating conditions. You can learn more about it here: http://asic.ethz.ch/2018/Kosmodrom.html … pic.twitter.com/H5LV7vmOS2

We have just taped out our second 22nm chip called Kosmodrom ☄️ in collaboration with . It has two independent Ariane cores (RV64ICMFD) optimized for different operating conditions. You can learn more about it here: http://asic.ethz.ch/2018/Kosmodrom.html … 😀🍾🎇

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There are many opportunities for innovation in the value chain from semiconductor materials and devices to services, but find out how the simplest one starts with substrates: https://bit.ly/2Omwoif  @Soitec_EN #RFSOI #FDXpic.twitter.com/MU00fwtFgG

There are many opportunities for innovation in the value chain from semiconductor materials and devices to services, but find out how the simplest one starts with substrates: https://bit.ly/2Omwoif 

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.@SemiEngineering reports: Boeing announced earlier this month it has licensed EFLX eFPGA on GF's 14LPP process and are in design. More companies, organizations and chips are in design, in contracting and in planning for GF's 14LPP/12LPP. https://bit.ly/2OSnDvY  @efpga

. reports: Boeing announced earlier this month it has licensed EFLX eFPGA on GF’s 14LPP process and are in design. More companies, organizations and chips are in design, in contracting and in planning for GF’s 14LPP/12LPP. https://bit.ly/2OSnDvY 

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Dr Thomas Morgenstern, Senior VP, @GLOBALFOUNDRIES' high-end 300mm manufacturing operations in Europe, introduces Europe's semiconductor ecosystem, including @CEA_Leti @ST_World @Soitec_EN @Fraunhoferpic.twitter.com/MC84ctMAiu

Dr Thomas Morgenstern, Senior VP, ‘ high-end 300mm manufacturing operations in Europe, introduces Europe’s semiconductor ecosystem, including

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@IEEEorg S3S San Francisco Oct 18th – Join the short-course on Emerging Applications for #FDSOI Technology – from @Soitec_EN @GLOBALFOUNDRIES @Dolphin_Int @ST_World Register today https://lnkd.in/eycdrDt  #howto #ieee #microelectronics #semiconductorspic.twitter.com/zmglPEklA3

S3S San Francisco Oct 18th – Join the short-course on Emerging Applications for Technology – from Register today https://lnkd.in/eycdrDt 

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Dr. Gary Patton of @GLOBALFOUNDRIES @GFfab8 presented a compelling keynote address at Silicon Summit – East, created through the strategic alliance of @SaratogaEconDev and @GlobalSemi. #SSE2018 https://www.bizjournals.com/albany/news/2018/10/10/globalfoundries-future-computer-chip-manufacturing.html?utm_campaign=trueAnthem:+Trending+Content&utm_content=5bbe13fa3ed3f00001669b61&utm_medium=trueAnthem&utm_source=twitter …

Dr. Gary Patton of presented a compelling keynote address at Silicon Summit – East, created through the strategic alliance of and . https://www.bizjournals.com/albany/news/2018/10/10/globalfoundries-future-computer-chip-manufacturing.html?utm_campaign=trueAnthem:+Trending+Content&utm_content=5bbe13fa3ed3f00001669b61&utm_medium=trueAnthem&utm_source=twitter …

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At #IMAPS2018, @GlobalFoundries' Dave McCann talked about everything from 2.5D, 3D, and #SRAM, to RF and #5G package test solutions and the promise of silicon photonics to enable #HeterogeneousIntegration. Packaging is the key to continuing #MooresLaw. @IMAPSOfficialpic.twitter.com/6GgkjfBJcV

At , ‘ Dave McCann talked about everything from 2.5D, 3D, and , to RF and package test solutions and the promise of silicon photonics to enable . Packaging is the key to continuing .

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Dr. Gary Patton of @GLOBALFOUNDRIES delivering the opening keynote at #SSE2018. Gary emphasizes that the “The world is changing” and Global Foundries is at the epicenter of the technology advancements making these changes happen.pic.twitter.com/OAV8Gie653

Dr. Gary Patton of delivering the opening keynote at . Gary emphasizes that the “The world is changing” and Global Foundries is at the epicenter of the technology advancements making these changes happen.

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Gary Patton of @GLOBALFOUNDRIES @GFfab8 delivers the opening keynote at Silicon Summit – East in Saratoga Springs, the first event developed through partnership between @SaratogaEconDev and @GlobalSemi, with support from @CEG_NY. #SSE2018pic.twitter.com/jNDdlYC7Id

Gary Patton of delivers the opening keynote at Silicon Summit – East in Saratoga Springs, the first event developed through partnership between and , with support from .

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@IEEEorg S3S San Francisco Oct 18th Short-course on Emerging Applications for #FDSOI Technology – including instructors from @Soitec_EN @Dolphin_Int @GLOBALFOUNDRIES @ST_World Register today http://s3sconference.org/conference-registration/ … #energyefficiencypic.twitter.com/NU3IJIx63R

S3S San Francisco Oct 18th Short-course on Emerging Applications for Technology – including instructors from Register today http://s3sconference.org/conference-registration/ …

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Advanced packaging continues to make progress as the industry moves towards a concept called heterogeneous integration. “The key area where we need to contribute in assembly and test is in heterogeneous integration,” said David McCann of GF. https://bit.ly/2RxDv5r 

Advanced packaging continues to make progress as the industry moves towards a concept called heterogeneous integration. “The key area where we need to contribute in assembly and test is in heterogeneous integration,” said David McCann of GF. https://bit.ly/2RxDv5r 

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Did you know? @imec_int @CEA_Leti @AmkorTechnology @GLOBALFOUNDRIES and TechSearch International, Inc. are #SEMICONEUROPA Keynotes of the 2018 Advanced Packaging Conference – Come meet them in #Munich, Nov 13-14 Sponsors: @EVGroup and SPIL https://buff.ly/2JkaVPQ  #semiconductorspic.twitter.com/sEAjIJ9BUx

Did you know? and TechSearch International, Inc. are Keynotes of the 2018 Advanced Packaging Conference – Come meet them in , Nov 13-14 Sponsors: and SPIL https://buff.ly/2JkaVPQ 

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Join @Dolphin_Int for a free #webinar October 16 to learn design solutions using #FDSOI process capabilities for energy-efficient #SoC in advanced nodes. Increase battery lifetime for #IoT applications. Choice of two dates Oct 16 & Oct 25 http://bit.ly/2xNFQB9  #energyefficiencypic.twitter.com/EGFSgHOCj2

Join for a free October 16 to learn design solutions using process capabilities for energy-efficient in advanced nodes. Increase battery lifetime for applications. Choice of two dates Oct 16 & Oct 25 http://bit.ly/2xNFQB9 

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Scotten Jones of IC Knowledge on GF’s pivot away from 7nm, "…more closely aligning your companies focus with your customers’ needs certainly appears to be a step in the right direction." https://bit.ly/2NZdgXp pic.twitter.com/J6xCdHtpqR

Scotten Jones of IC Knowledge on GF’s pivot away from 7nm, “…more closely aligning your companies focus with your customers’ needs certainly appears to be a step in the right direction.” https://bit.ly/2NZdgXp 

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The added features to 14/12nm #FinFET deliver better scalability & performance for applications in high-growth markets such as hyperscale #datacenters and #autonomousvehicles. @GLOBALFOUNDRIES https://www.electronicsmedia.info/2018/09/29/global-foundries-added-features-to-its-14-12nm-finfet-offering/ …

The added features to 14/12nm deliver better scalability & performance for applications in high-growth markets such as hyperscale and . https://www.electronicsmedia.info/2018/09/29/global-foundries-added-features-to-its-14-12nm-finfet-offering/ …

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Check it out: #FDSOI @soiconsortium member @GLOBALFOUNDRIES #FDXcelerator partner @QuickLogic_Corp puts #ultralowpower eFPGA on #22FDX & in @ETH_en #PULP #RISC_V SoC http://bit.ly/QLeFPGA  #chipdesign #IoT #wearables #edgecomputing #semiconductors

Check it out: member partner puts eFPGA on & in SoC http://bit.ly/QLeFPGA 

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