「GLOBALFOUNDRIES」カテゴリーアーカイブ

Today AMD announced a new WSA, reaffirming that GF is a critical supplier of AMD’s current generation products. Learn how GF will play a key role in AMD's next-gen products with their 'chiplet' strategy. #evolution https://bit.ly/2MKVTpL 

Today AMD announced a new WSA, reaffirming that GF is a critical supplier of AMD’s current generation products. Learn how GF will play a key role in AMD’s next-gen products with their ‘chiplet’ strategy. https://bit.ly/2MKVTpL 

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Connected & autonomous vehicles are getting closer to reality and demands for high-density and energy-efficient embedded NVM solutions are expected to grow in automotive applications. Find out how GF is making strides in this area @SemiEngineering: https://bit.ly/2DIf2FL 

Connected & autonomous vehicles are getting closer to reality and demands for high-density and energy-efficient embedded NVM solutions are expected to grow in automotive applications. Find out how GF is making strides in this area : https://bit.ly/2DIf2FL 

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Join us in May at #ASMC2019! Christine Dunbar, VP of RF Business Unit, will share her perspective on the industry and how differentiated technologies are enabling a new connected era. Registration is open! https://bit.ly/2BcQMdb pic.twitter.com/9kY7qWv30X

Join us in May at ! Christine Dunbar, VP of RF Business Unit, will share her perspective on the industry and how differentiated technologies are enabling a new connected era. Registration is open! https://bit.ly/2BcQMdb 

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It's not too late to join us for Tuesday's #5G workshop in #SantaClara! Hear from experts at #ANSYS, @GLOBALFOUNDRIES & @rambusinc. No #DesignCon badge required, but you will need to pre-register to attend: https://bit.ly/2FUMCKd pic.twitter.com/Bn0oU4VZOw

It’s not too late to join us for Tuesday’s workshop in !
Hear from experts at , & .

No badge required, but you will need to pre-register to attend: https://bit.ly/2FUMCKd 

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In this new #GFcast, Michael Sun summarizes our SmartPower offerings, including BCD and BCDLite® technologies for mobility, automotive, industrial, AC-DC sensor and other applications. Watch now & learn more! https://bit.ly/2FVPHJM 

In this new , Michael Sun summarizes our SmartPower offerings, including BCD and BCDLite® technologies for mobility, automotive, industrial, AC-DC sensor and other applications. Watch now & learn more! https://bit.ly/2FVPHJM 

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#CES2019 was filled with companies sharing their ambitious plans on how they're prepared to support a #5G world. In a new #GFcast, Shankaran Janardhanan showcases how GF's RF technology solutions enable a range of 5G applications. https://bit.ly/2AHcEgw 

was filled with companies sharing their ambitious plans on how they’re prepared to support a world. In a new , Shankaran Janardhanan showcases how GF’s RF technology solutions enable a range of 5G applications. https://bit.ly/2AHcEgw 

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New IP: Single Port, Ultra Low Power, Low Voltage, @GLOBALFOUNDRIES #22FDX, Single Port Compiler from @MobileSemicond1 https://www.design-reuse.com/sip/single-port-ultra-low-power-low-voltage-gf-22fdx-single-port-compiler-ip-45880/ … #SemIP

New IP: Single Port, Ultra Low Power, Low Voltage, , Single Port Compiler from https://www.design-reuse.com/sip/single-port-ultra-low-power-low-voltage-gf-22fdx-single-port-compiler-ip-45880/ …

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Wafer Bonding Technology: Application Drivers and Process Development: Dan Smith, 3D Packaging Integration Engineer, @GLOBALFOUNDRIES will present at #3D&Systems Summit in #Dresden, 28-30 January 2019. Register now: https://buff.ly/2VoJTOg pic.twitter.com/eypJJxemdP

Wafer Bonding Technology: Application Drivers and Process Development:
Dan Smith, 3D Packaging Integration Engineer, will present at &Systems Summit in , 28-30 January 2019. Register now: https://buff.ly/2VoJTOg 

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Excitement for what’s ahead at #CES2019. Once again, @CTATech brings it with a brill video. What an incredible ecosystem to be part of. Inspiration to #miniaturize and integrate semiconductors to push systems and application boundaries like never before. #SiP #integration #AIpic.twitter.com/8ZbMzqfbhH – At The Las Vegas Strip

Excitement for what’s ahead at . Once again, brings it with a brill video. What an incredible ecosystem to be part of. Inspiration to and integrate semiconductors to push systems and application boundaries like never before. – At The Las Vegas Strip

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According to @PaulyAlcorn AMD has moved from GF's 14nm to 12nm process providing higher clock speeds within a similar power range for its second-gen Ryzen 3000-series. https://bit.ly/2CUPjtn  @tomshardwarepic.twitter.com/JF8IVLl7v1

According to AMD has moved from GF’s 14nm to 12nm process providing higher clock speeds within a similar power range for its second-gen Ryzen 3000-series. https://bit.ly/2CUPjtn 

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Best news you'll hear all week: We'll be streaming Ginni Rometty's keynote LIVE at #CES2019, tomorrow on http://ibm.com ! Tune in at 8:30 am PST to hear the #IBM Chairman, President & CEO open the conference. https://ibm.co/2Qv6BAE pic.twitter.com/IfXIv7RNGG

Best news you’ll hear all week: We’ll be streaming Ginni Rometty’s keynote LIVE at , tomorrow on http://ibm.com ! Tune in at 8:30 am PST to hear the Chairman, President & CEO open the conference. https://ibm.co/2Qv6BAE 

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#ICYMI In this recent Foundry Files article, we examine the new effort to come up with new, less power-hungry devices for neuromorphic computing and why advanced packaging will play a key role. http://bit.ly/2QT5FKC  #AI #computingpic.twitter.com/UU7OdD4jWu

In this recent Foundry Files article, we examine the new effort to come up with new, less power-hungry devices for neuromorphic computing and why advanced packaging will play a key role. http://bit.ly/2QT5FKC 

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