ニュースリリース
  • ホーム
  • Infineon
  • NXP
  • Renesas
  • アルプス電気
  • 第一電子工業
  • エプソン
  • フォスター電機
  • 本多通信工業
  • 北陸電気工業
  • 日立製作所
  • ホシデン
  • イリソ電子工業
  • イビデン
  • KOA
  • 京セラ
  • キーエンス
  • 村田製作所
  • ミネベア
  • ミネベアミツミ
  • 日本航空電子工業
  • ニチコン
  • NKKスイッチズ
  • NECトーキン
  • 日本メクトロン
  • 日東電工
  • 日本電産
  • 日本シイエムケイ
  • 日本ケミコン
  • オムロン
  • 沖電気
  • 岡谷電機産業
  • オーナンバ
  • パナソニック
  • パナソニックデバイスSUNX
  • ローム
  • ルビコン
  • ソニー
  • SMK
  • サトーパーツ
  • スミダ
  • TDK
  • 東芝
  • 太陽誘電
  • 田淵電機
  • Broadcom
  • GLOBALFOUNDRIES
  • intel
  • MediaTek
  • Micron
  • NVIDIA
  • ON Semi
  • Qualcomm
  • Samsung
  • SMK
  • SONY Semicon
  • STMicroelectronics
  • TI
  • TOSHIBA Semicon

Category : GLOBALFOUNDRIES

Headed to #MWC2019? Meet us there, so we can share how our solutions are enabling various innovative #5G applications. Here is one example: https://bit.ly/2GnIuDx pic.twitter.com/XiU3tSyfdz

Posted on 2019年2月20日2019年2月20日 by denshilink

Headed to #MWC2019? Meet us there, so we can share how […]

We've teamed up with @Dolphin_Int to develop a unique series of adaptive body bias solutions for 22FDX that will enable a number of high-growth applications such as #5G, IoT and automotive. Learn more: https://bit.ly/2SJi0mo pic.twitter.com/0lFE6WeDqX

Posted on 2019年2月20日2019年2月20日 by denshilink

We’ve teamed up with @Dolphin_Int to develop a un […]

The count down begins! #MWC19 starts in 7 days. What #5G enablers will you be showcasing? #MWLIVE #22FDX #RFSOI https://bit.ly/2Nd6CcC pic.twitter.com/CQ63W4e7Li

Posted on 2019年2月18日2019年2月19日 by denshilink

The count down begins! #MWC19 starts in 7 days. What #5 […]

GLOBALFOUNDRIES Talks About Enabling Development of 5G ICs https://lnkd.in/e5Zz2CY  #semiconductorindustry @GLOBALFOUNDRIES #5gfactspic.twitter.com/sfVQbj2AO0

Posted on 2019年2月14日2019年2月17日 by denshilink

GLOBALFOUNDRIES Talks About Enabling Development of 5G […]

GF's RF expert, Peter Rabbeni, speaks with SemiWiki about enabling development of #5G ICs. Just in time for #MWC19! https://bit.ly/2DKynFh  @DanielNennipic.twitter.com/EqanpgvxS4

Posted on 2019年2月13日2019年2月14日 by denshilink

GF’s RF expert, Peter Rabbeni, speaks with SemiWi […]

GF and the University of California San Diego (UCSD) have developed a power amplifier operating at 28GHz with output power of 22dBm and more than 40% power-added efficiency. Read more: https://bit.ly/2GnIuDx 

Posted on 2019年2月13日 by denshilink

GF and the University of California San Diego (UCSD) ha […]

Friday Feature Photo: Winter Scene, Lyndon VT. Submitted by GF employee, Dwight Safer, Fab 9, Burlington.pic.twitter.com/mD0DktzfCj

Posted on 2019年2月1日2019年2月2日 by denshilink

Friday Feature Photo: Winter Scene, Lyndon VT. Submitte […]

Today AMD announced a new WSA, reaffirming that GF is a critical supplier of AMD’s current generation products. Learn how GF will play a key role in AMD's next-gen products with their 'chiplet' strategy. #evolution https://bit.ly/2MKVTpL 

Posted on 2019年1月30日 by denshilink

Today AMD announced a new WSA, reaffirming that GF is a […]

Connected & autonomous vehicles are getting closer to reality and demands for high-density and energy-efficient embedded NVM solutions are expected to grow in automotive applications. Find out how GF is making strides in this area @SemiEngineering: https://bit.ly/2DIf2FL 

Posted on 2019年1月30日 by denshilink

Connected & autonomous vehicles are getting closer […]

Join us in May at #ASMC2019! Christine Dunbar, VP of RF Business Unit, will share her perspective on the industry and how differentiated technologies are enabling a new connected era. Registration is open! https://bit.ly/2BcQMdb pic.twitter.com/9kY7qWv30X

Posted on 2019年1月30日2019年1月30日 by denshilink

Join us in May at #ASMC2019! Christine Dunbar, VP of RF […]

Guido Überreiter, VP Pre & PostFab Operations at @GLOBALFOUNDRIES to open the 2019 3D & Systems Summit in #Dresden #3DSummitpic.twitter.com/yBjq7uOuQz

Posted on 2019年1月29日2019年1月30日 by denshilink

Guido Überreiter, VP Pre & PostFab Operations […]

It's not too late to join us for Tuesday's #5G workshop in #SantaClara! Hear from experts at #ANSYS, @GLOBALFOUNDRIES & @rambusinc. No #DesignCon badge required, but you will need to pre-register to attend: https://bit.ly/2FUMCKd pic.twitter.com/Bn0oU4VZOw

Posted on 2019年1月26日2019年1月29日 by denshilink

It’s not too late to join us for Tuesday’s […]

GF’s FinFET offering expert describes how our FinFET platform has been positioned in 2018 to provide value for future high growth semiconductor market segments. Watch now! http://bit.ly/2B3gKQt 

Posted on 2019年1月25日 by denshilink

GF’s FinFET offering expert describes how our Fin […]

Join GF’s RF expert Peter Rabbeni @ANSYS 5G DesignCon workshop on Tuesday, Jan. 29, where he will share a 5G update and the technologies that are enabling it. http://bit.ly/2B55YsN 

Posted on 2019年1月25日 by denshilink

Join GF’s RF expert Peter Rabbeni @ANSYS 5G Desig […]

In this new #GFcast, Michael Sun summarizes our SmartPower offerings, including BCD and BCDLite® technologies for mobility, automotive, industrial, AC-DC sensor and other applications. Watch now & learn more! https://bit.ly/2FVPHJM 

Posted on 2019年1月23日 by denshilink

In this new #GFcast, Michael Sun summarizes our SmartPo […]

Congrats @EverspinTech! The company has started sampling 1Gb STT-MRAM chips, using GF's 28nm process technology on 300mm wafers. https://bit.ly/2CrDR6P 

Posted on 2019年1月16日 by denshilink

Congrats @EverspinTech! The company has started samplin […]

There's a new wave of 2.5D/3D, fan-out and other advanced IC packages expected to flood the market over the next year, here's a summary of major technologies coming down the pike. https://bit.ly/2Hd9Opb  @SemiEngineering

Posted on 2019年1月16日 by denshilink

There’s a new wave of 2.5D/3D, fan-out and other […]

With decades of development behind it, embedded STT-MRAM is coming to market. In his latest article, @dplammers explores how MRAM is crossing the chasm. https://bit.ly/2RxC6zK pic.twitter.com/OyzlbxlXdu

Posted on 2019年1月15日2019年1月15日 by denshilink

With decades of development behind it, embedded STT-MRA […]

#CES2019 was filled with companies sharing their ambitious plans on how they're prepared to support a #5G world. In a new #GFcast, Shankaran Janardhanan showcases how GF's RF technology solutions enable a range of 5G applications. https://bit.ly/2AHcEgw 

Posted on 2019年1月14日 by denshilink

#CES2019 was filled with companies sharing their ambiti […]

In this recent #GFcast, Jamie Schaeffer shares how #FDX #FDSOI technologies are winning in growth markets including Edge AI/ML, Mobile, Automotive, IoT and 5G/Networking. Watch to learn more! https://bit.ly/2Rkui4c 

Posted on 2019年1月11日 by denshilink

In this recent #GFcast, Jamie Schaeffer shares how #FDX […]

New IP: Single Port, Ultra Low Power, Low Voltage, @GLOBALFOUNDRIES #22FDX, Single Port Compiler from @MobileSemicond1 https://www.design-reuse.com/sip/single-port-ultra-low-power-low-voltage-gf-22fdx-single-port-compiler-ip-45880/ … #SemIP

Posted on 2019年1月10日 by denshilink

New IP: Single Port, Ultra Low Power, Low Voltage, @GLO […]

Wafer Bonding Technology: Application Drivers and Process Development: Dan Smith, 3D Packaging Integration Engineer, @GLOBALFOUNDRIES will present at #3D&Systems Summit in #Dresden, 28-30 January 2019. Register now: https://buff.ly/2VoJTOg pic.twitter.com/eypJJxemdP

Posted on 2019年1月10日2019年1月10日 by denshilink

Wafer Bonding Technology: Application Drivers and Proce […]

Join us January 20 & 21 to hear from GF experts on advances in SOI technologies and high performance FEMs. https://bit.ly/2RCY6s0  #mmwave #RFSOIhttps://twitter.com/RadioWirelessWk/status/1081706803593916422 …

Posted on 2019年1月9日 by denshilink

Join us January 20 & 21 to hear from GF experts on […]

A new cutting-edge voice processing technology designed using 22nm process tech! https://bit.ly/2VF2SEp  #alwayson #22FDX #poweringintelligencehttps://twitter.com/SynaCorp/status/1082328617831456768 …

Posted on 2019年1月9日 by denshilink

A new cutting-edge voice processing technology designed […]

Excitement for what’s ahead at #CES2019. Once again, @CTATech brings it with a brill video. What an incredible ecosystem to be part of. Inspiration to #miniaturize and integrate semiconductors to push systems and application boundaries like never before. #SiP #integration #AIpic.twitter.com/8ZbMzqfbhH – At The Las Vegas Strip

Posted on 2019年1月8日2019年1月9日 by denshilink

Excitement for what’s ahead at #CES2019 . Once ag […]

CES Unveiled Las Vegas: Kicking-off #CES2019pic.twitter.com/3aQ78SrOAr

Posted on 2019年1月8日2019年1月9日 by denshilink

CES Unveiled Las Vegas: Kicking-off #CES2019 pic.twitte […]

upgraded microarchitecture going from Zen to Zen+, as well as additional frequency headroom and lower power offered by GF's 12nm process https://twitter.com/anandtech/status/1081959195661033472 …

Posted on 2019年1月8日 by denshilink

upgraded microarchitecture going from Zen to Zen+, as w […]

According to @PaulyAlcorn AMD has moved from GF's 14nm to 12nm process providing higher clock speeds within a similar power range for its second-gen Ryzen 3000-series. https://bit.ly/2CUPjtn  @tomshardwarepic.twitter.com/JF8IVLl7v1

Posted on 2019年1月8日2019年1月8日 by denshilink

According to @PaulyAlcorn AMD has moved from GF’s […]

Best news you'll hear all week: We'll be streaming Ginni Rometty's keynote LIVE at #CES2019, tomorrow on http://ibm.com ! Tune in at 8:30 am PST to hear the #IBM Chairman, President & CEO open the conference. https://ibm.co/2Qv6BAE pic.twitter.com/IfXIv7RNGG

Posted on 2019年1月8日2019年1月9日 by denshilink

Best news you’ll hear all week: We’ll be st […]

Can't make it to Las Vegas for #CES2019? Tune in January 9th at 9AM PT to watch AMD CEO @LisaSu present the corporate keynote on YouTube. http://bit.ly/AMDCES pic.twitter.com/mjnAoarDCr

Posted on 2019年1月5日2019年1月10日 by denshilink

Can’t make it to Las Vegas for #CES2019 ? Tune in […]

« 前へ 1 2 3 4 5 … 42 次へ »

ニュースリリース, Copyright ©  2026.