Company’s new MOB10 contactless chip module transforms how passports and identity cards are designed while adding more security layers and features
News Highlights:
NXP is the first in the market to offer a contactless chip module with a thickness of <200 µm, representing the world’s thinnest contactless chip module available in high-volume
MOB10 supports polycarbonate technology to add additional security layers and features on the identity document while maintaining document robustness.
MOB10 builds on the proven MOB industry platform enabling a smooth transition without additional production investment
EINDHOVEN, The Netherlands, Oct. 17, 2017 (GLOBE NEWSWIRE) — NXP S…
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