NXP Revolutionizes ID Security and Durability with World’s Thinnest Contactless Chip Module

Company’s new MOB10 contactless chip module transforms how passports and identity cards are designed while adding more security layers and features
News Highlights:

NXP is the first in the market to offer a contactless chip module with a thickness of <200 µm, representing the world’s thinnest contactless chip module available in high-volume
MOB10 supports polycarbonate technology to add additional security layers and features on the identity document while maintaining document robustness.
MOB10 builds on the proven MOB industry platform enabling a smooth transition without additional production investment

EINDHOVEN, The Netherlands, Oct. 17, 2017 (GLOBE NEWSWIRE) — NXP S…

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