Reliability of fine pitch hybrid bonding interconnects: Joris Jourdon, PhD student, @ST_World will present at #3S&Systems Summit in #Dresden, 28-30 January 2019. Register now! https://buff.ly/2VoJTOg pic.twitter.com/8CkxuSDkB7

Reliability of fine pitch hybrid bonding interconnects: Joris Jourdon, PhD student, will present at &Systems Summit in , 28-30 January 2019. Register now! https://buff.ly/2VoJTOg 

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