Mobile World Congress: Infineon announces eSIM solution for mobile consumer devices

Munich, Germany – 25 February 2019 – Infineon Technologies AG (FSE: IFX / OTCQX: IFNNY) presents its new embedded SIM (eSIM) solution designed specifically for mobile consumer devices at Mobile World Congress (Barcelona, Spain, 25-28 February, Hall 6, stand 6C41). Infineon offers manufacturers of …

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