NXP Front-End Solutions Change the Game for 5G

New Portfolio of RF Solutions Offers Industry’s Highest Levels of Integration and Performance for Enabling Cost-effective massive MIMO Active Antenna Systems
PHILADELPHIA, June 12, 2018 (GLOBE NEWSWIRE) — IMS2018 — NXP Semiconductors N.V. (NASDAQ:NXPI) today announced the immediate availability of its new RF Front-End Solutions for 5G infrastructure enablement.  NXP’s portfolio addresses several of the thorniest issues — power amplifier integration, shrinking board space, and true footprint and pin-compatibility between variants — involved in creating the cellular infrastructure for massive multiple-input, multiple output (mMIMO) and, by extension, 5G.


NXP, Mastercard and Visa Transform Mobile Payments for Billions of IoT Devices

New NXP mWallet 2GO secure service enables Montblanc’s TWIN smart strap
AMSTERDAM, The Netherlands, June 07, 2018 (GLOBE NEWSWIRE) — NXP Semiconductors N.V. (NASDAQ:NXPI) in collaboration with Mastercard (NYSE:MA), and Visa today announced the launch of its new mWallet 2GO, a white label wallet service developed on the NXP Secure Service 2GO Platform. With the new service, NXP is first in the industry to offer the full scope of mobile wallet development in one solution including leading hardware technology, surrounding software and ecosystem integration. The payment solution is designed to ease development, reduce cost, and accelerate time-to-market for OEMs (Original Equipment Manufactu…


NXP and Baidu Partner to Secure the IoT in China

Jointly establish secure IoT ecosystems and ensure security in the era of Big Data and AI
SHANGHAI, China, June 06, 2018 (GLOBE NEWSWIRE) — NXP Semiconductors (NASDAQ:NXPI), a leading provider of IoT (Internet-of-Things) security solutions, today announced a strategic partnership agreement with Baidu Cloud. The two companies will collaborate to promote industry innovation and support developers and ecosystem partners in building safe and smart IoT applications.

As part of the partnership, NXP will support Baidu’s smart IoT platform, “Tiangong,” from cloud to IoT device security with its industry-leading Secure Element (SE) solution. With NXP SE embedded in each IoT device, Tiangong wil…


NXP Brings Standard Packages to RF Power

New RF Power Transistors Simplify Design and Manufacturing
EINDHOVEN, The Netherlands, June 05, 2018 (GLOBE NEWSWIRE) — Ease of use and design re-use across frequencies have not traditionally been associated with RF power solutions — until now. Today, NXP Semiconductors N.V. (NASDAQ:NXPI), the leader in RF power, introduces two new power blocks that promise to become a new standard for years to come.

New Transistors from NXP Semiconductors


NXP Semiconductors Reports First Quarter 2018 Results

Q1 2018

$2.269 billion

GAAP Gross margin

GAAP Operating margin


Non-GAAP Gross margin

Non-GAAP Operating margin 

EINDHOVEN, The Netherlands, May 02, 2018 (GLOBE NEWSWIRE) — NXP Semiconductors N.V. (NASDAQ:NXPI) today reported financial results for the first quarter 2018 ended April 1, 2018. 
NXP delivered first quarter revenue of $2.27 billion, an increase of approximately 3 percent year on year, and a decrease of 8 percent as compared to the prior quarter, with the annual period comparison impacted by the divestment of the Standard Products…


NXP #3 on List of Top Companies for Artificial Intelligence Chipset Innovation

EINDHOVEN, Netherlands, April 25, 2018 (GLOBE NEWSWIRE) — NXP Semiconductors N.V. (NASDAQ:NXPI), has been named one of the world’s top three Artificial Intelligence (AI) chipset companies based on recently released research by Compass Intelligence (CompassIntel.com). The A-List includes best-in-class, best-in-breed and the “who’s who” in mobile, Internet-of-Things (IoT) and emerging technologies. NXP is joined by NVIDIA and Intel on the A-List in the AI Chipset Index of companies that are leading AI innovation.    

NXP is joined by N…


NXP Semiconductors Announces the Timing of the Release of First Quarter 2018 Results

EINDHOVEN, The Netherlands, April 19, 2018 (GLOBE NEWSWIRE) — NXP Semiconductors N.V. (NASDAQ:NXPI) today announced it will release its first quarter 2018 financial results after the close of extended trading on the NASDAQ Global Select Market on Wednesday, May 2, 2018 EDT.

NXP will not hold an earnings call nor provide forward guidance for the second quarter of 2018 due to the pending acquisition of NXP by Qualcomm.
About NXP Semiconductors
NXP Semiconductors N.V. (NASDAQ:NXPI) enables secure connections and infrastructure for a smarter world, advancing solutions that make lives easier, better, and safer. As the world leader in secure connectivity solutions for embedded applications, …


NXP and JD.com Announce Strategic IoT Partnership in China

Companies combine industry-leading e-commerce expertise and resources,secure edge compute solutions and embeddedAItechnology to bring new products and services to marketSHANGHAI, CHINA, April 2, 2018 – NXP Semiconductors (NASDAQ: NXPI), a leading provider of secure edge compute and IoT (Internet of Things) solutions, today signed a strategic Memorandum of Understanding with JD.com, the largest e-commerce platform in China to collaborate on the development of IoT and AI solutions, products and services. The joint effort will leverage and combine JD.com’s expertise and capabilities in e-commence and data analysis as well as operations in finance, logistics and marketing, with innovative techno…


NXP and AliOS Partner for New In-Vehicle Experiences

NXP will pair i.MX applications processors with Alibaba’s AliOS for next-gen auto e-cockpit
Offers new opportunities for AI, IoT and multi-screen in-vehicle experiences
Partnership aims to install AliOS system and NXP’s automotive infotainment solution in millions of vehicles in China by 2020

SHENZHEN, China, March 28, 2018 (GLOBE NEWSWIRE) — NXP Semiconductors N.V. (NASDAQ:NXPI), the world’s largest supplier of automotive semiconductors and AliOS, the operating system for Internet of Things (IoT) solutions developed by Alibaba Group, have entered into a partnership to further drive the development of smart cars in China. The partnership aims to install the AliOS system and NXP’s…


NXP’s New Automotive Echo Cancellation Noise Reduction Solution Makes Calls Clear

New ECNR solution comes integrated in NXP chipsets with ITU-T P100 and CarPlay® pre-certification
EINDHOVEN, The Netherlands, March 27, 2018 (GLOBE NEWSWIRE) — NXP Semiconductors N.V. (NASDAQ:NXPI), has announced a new echo cancellation noise reduction solution (ECNR) that significantly reduces the problem of noisy voice communications and provides carmakers with a consumer pleasing, hands-free calling experience. The cost-effective solution combines innovative ECNR software that can be easily ported onto NXP i.MX processors and NXP’s leading car radio tuners and DSPs1. The new NXP ECNR solution is also ITU-T P1110 and CarPlay® pre-certified.


NXP’s MIFARE 2GO and Google Pay Transform Public Transportation

Companies integrate NXP’s MIFARE 2GO with Google Pay to provide seamless mobile travel experiences
SAN JOSE, Calif., March 19, 2018 (GLOBE NEWSWIRE) — Today NXP Semiconductors N.V. (NASDAQ:NXPI), a leader in secure connectivity solutions and inventor of MIFARE, the leading contactless payment and access solution for transportation used in over 750 cities worldwide, announced it has collaborated with Google to integrate NXP’s new MIFARE 2GO cloud service, a complete end-to-end solution that manages digitized MIFARE-based credentials onto mobile and wearable devices, with Google Pay.

The integration aims to provide an enjoyable travel experience for commuters allowing them to purchase a …


NXP Semiconductors Announces Redemption of 3.75% Senior Notes Due 2018

EINDHOVEN, The Netherlands, March 09, 2018 (GLOBE NEWSWIRE) — NXP Semiconductors N.V. (NASDAQ:NXPI) through its subsidiaries NXP B.V. and NXP Funding LLC, delivered notice on March 9, 2018 to the holders of its 3.75 percent Senior Notes due 2018 that it will fully redeem on April 9, 2018, the $750 million of outstanding principle (the “Note Redemption”). 

The company will utilize cash on its balance sheet to fund the planned Note Redemption.
This announcement is for informational purposes only.
About NXP Semiconductors
NXP Semiconductors N.V. (NASDAQ:NXPI) enables secure connections and infrastructure for a smarter world, advancing solutions that make lives easier, better and safer. …


NXP Semiconductors Announces Redemption of 5.75% Senior Notes Due 2023

EINDHOVEN, The Netherlands, March 02, 2018 (GLOBE NEWSWIRE) — NXP Semiconductors N.V. (NASDAQ:NXPI) through its subsidiaries NXP B.V. and NXP Funding LLC, delivered notice on March 2, 2018 to the holders of its 5.75 percent Senior Notes due 2023 that it will fully redeem on April 2, 2018, the $500 million of outstanding principle (the “Note Redemption”). 

The company will utilize cash on its balance sheet to fund the planned Note Redemption.
This announcement is for informational purposes only.
About NXP Semiconductors
NXP Semiconductors N.V. (NASDAQ:NXPI) enables secure connections and infrastructure for a smarter world, advancing solutions that make lives easier, better and safer. …


NXP Ushers in New Era of eSIM-enabled Devices for 5G and IoT With Industry’s First Single NFC and Secure Element Monolithic Chip

Company’s eSIM family includes the SN100U, the world’s most integrated “all-in-one” chipset featuring NFC, Secure Element, and eSIM and the SU070 a 40nm Secure element, offering mobile wallet security and eSIM solutions
BARCELONA, Spain, Feb. 28, 2018 (GLOBE NEWSWIRE) — NXP Semiconductors N.V. (NASDAQ:NXPI), today announced breakthroughs in GSMA-compliant eSIM solutions that radically make it easier for device manufacturers to bring consumers remote SIM provisioning and over-the-air updates with multiple Mobile Network Operator (MNO) subscriptions. With its latest chip innovations, NXP responds to the demands of the steadily growing eSIM market, which is projected to increase nearly seve…


NXP Announces Miniaturized “IoT-on-a-Chip” Solution to Advance the Future of Edge Computing

Compact, flexible system combines i.MX processor, Wi-Fi connectivity and security to fast track IoT products to marketNUREMBERG, GERMANY (Embedded World 2018) – February 27, 2018 – NXP Semiconductors today announced its new IoT-on-a-Chip that significantly advances the future of edge computing. The scalable offering packs NXP’s ARM®-based i.MX applications processor, Wi-Fi and Bluetooth into a much smaller size, bringing a broad range of functionality, security and connectivity to IoT devices.

The new chip addresses the daunting task of designing applications for extremely size-constrained IoT devices. As a system-level miniaturized solution, IoT-on-a-Chip delivers the necessar…


NXP Expands i.MX RT Crossover Processor Portfolio with Powerful New Capabilities for Edge Node Computing

Nuremberg, Germany (Embedded World 2018) – February 27, 2018 – NXP Semiconductors today announced the i.MX RT1060, the latest addition to the i.MX RT crossover processors line that expands the series to three scalable families. The new processor family introduces new features designed for real-time applications such as increased on-chip memory to 1MB, expanded connectivity options with High Speed GPIO, CAN-FD, and synchronous parallel NAND/NOR/PSRAM controller.
The i.MX RT crossover series bridges the gap between high performance and integration while minimizing costs to meet today’s need for high performance embedded processors for millions of connected edge devices in the Int…


NXP Introduces New Family of Multi-Core Applications Processors Built in Advanced 14LPC FinFET Technology

Scalable core complex of Arm Cortex-A53 running up to 2GHz plus Cortex-M4 real-time processing for edge compute and machine learning applications NUREMBERG, GERMANY (Embedded World 2018) – February 27, 2018 – Building upon the decade-long success of i.MX 6 series general purpose applications processor family, the i.MX 8M Mini is NXP’s first embedded multi-core heterogeneous applications processors built using advanced 14LPC FinFET process technology. The i.MX 8M Mini family of processors brings together high-performance compute, power efficiency, and embedded security needed to drive the growth of fast-growing edge node computing, streaming multimedia, and machine learning applicat…


Next-Generation Kinetis Wireless Microcontrollers Increase Performance and Security for IoT Devices

Single-chip, dual-core MCU supports Bluetooth 5, Thread and Zigbee while increasing security for consumer and industrial IoT devices
NUREMBERG, GERMANY (Embedded World 2018) – February 27, 2018 – Many devices today require a host microcontroller (MCU) connected to a radio which increases size and complexity, while also making design, software development, procurement, supply planning and logistics more complex. Part of NXP’s broad edge computing portfolio, which allows devices to be more powerful and secure, is the new K32W0x wireless MCU platform – representing the next-generation of Kinetis MCUs. The K32W0x platform bridges its predecessor parts by providing a scalable path wi…


NXP Leads Edge Computing Revolution – High-Performance Compute, Security, and Ecosystem

NXP delivers cutting-edge Machine Learning (ML) capable solutions to IoT developers for smart, secure, and aware edge nodes

NXP introduces latest i.MX 8M family of costeffective applications processors built in advanced 3rd generation 14LPC FinFET technology with scalable edge node computing from single, dual, to quad-core versions of Arm Cortex-A53.
NXP debuts new high-performance IoT-on-a-Chip bringing Arm Cortex-A7 applications processor and high bandwidth Dual-band 802.11ac Wi-Fi and Bluetooth 4.2 together in an ultra-compact 14x14x2.7mm package targeted for edge devices.
NXP is also announcing functionally verified MCUs in 28nm FD-SOI with break-through on-chip …


NXP Integrates Layerscape Family of Arm-based Processors with Microsoft Azure IoT for Secure Edge Computing

NUREMBERG, Germany, Feb. 27, 2018 (GLOBE NEWSWIRE) — NXP Semiconductors N.V. (NASDAQ:NXPI), a worldwide leader in advanced secure connectivity solutions, today announced that its NXP Layerscape System-on-Chip (SoC) platforms are integrated with Microsoft Azure IoT Edge. The result is that developers can easily create a variety of ready-to-use applications within the rich framework provided by Azure IoT Edge on trusted computing platforms.

The promise of running cloud-based applications on edge devices requires a secure execution environment. Layerscape SoCs enable secure execution for Azure IoT Edge computing running networking, data analytics, and compute-intensive machine learning app…


NXP Introduces New Innovative “Plug and Trust” Approach to IoT Security Using NXP A71CH Trust Anchor

New IoT security solution for cloud onboarding, mutual device authentication, and edge node security reduces design-in complexity
NUREMBERG, Germany, Feb. 27, 2018 (GLOBE NEWSWIRE) — (Embedded World 2018) – February 27, 2018 – NXP Semiconductors N.V. (NASDAQ:NXPI), a leading provider of secure Internet-of-Things (IoT) embedded solutions serving customers across a broad spectrum of applications and markets, today introduced its new A71CH Secure Element (SE), a trust anchor, ready-to-use security solution for next-generation IoT devices, such as edge nodes and gateways. Designed to secure peer-to-peer or cloud connections, the chip comes with the required credentials pre-injected for auton…


NXP Unlocks the IoT to a Broader Spectrum of Innovators, Announces Rapid IoT Prototyping Kit for Creating Proof-of-Concept Designs

New kit dramatically accelerates development of proof-of-concept designs for IoT edge node device; creation of sensor-to-cloud IoT prototypes can take just a matter of minutes

Power-optimized, secure and extremely easy to use prototyping solution, dramatically simplifies the development of Proof-of-Concept (PoC) IoT edge nodes for consumer, commercial and industrial markets.

NUREMBERG, Germany, Feb. 27, 2018 (GLOBE NEWSWIRE) — (Embedded World 2018) …


NXP Unveils EdgeScale: A Secure, Scalable, Device-Management Suite for Edge Computing

NUREMBERG, Germany, Feb. 27, 2018 (GLOBE NEWSWIRE) — NXP Semiconductors™ N.V. (NASDAQ:NXPI), a worldwide leader in advanced secure connectivity solutions, today began the roll out of a management suite for secure edge computing. NXP’s EdgeScale suite provides a set of cloud-based tools and services for secure manufacturing and enrollment of IoT and edge-computing devices. The solution provides a secure mechanism for developers to leverage popular cloud-computing frameworks for their applications and remotely deploy and manage an unlimited number of edge devices.


NXP and Kontron Collaborate on Edge Computing for the Industrial IoT

NUREMBERG, Germany, Feb. 27, 2018 (GLOBE NEWSWIRE) — NXP Semiconductors N.V. (NASDAQ:NXPI) and Kontron, part of technology group S&T, today announced their collaboration to couple NXP’s i.MX and Layerscape families of Arm®-based processors with Kontron/S&T’s expertise in hardware and software to create Industry 4.0 solutions. The products will leverage Microsoft Azure IoT and Time Sensitive Networking (TSN) technologies to meet the needs of next-generation Industrial IoT implementations for cloud, edge computing and factory floor innovations.


NXP, First to Achieve Qi Certification of MP-A11 Wireless Power Transmitter Reference Design for Mobile Devices, supporting 15W Qi, 7.5W iPhone charging and Samsung Fast Charge

NXP Semiconductors today announced it is first to receive the Qi-certification from the Wireless Power Consortium for their MP-A11 fixed-frequency transmitter reference design supporting the Extended Power Profile (EPP) up to 15W, which covers 7.5W charging for the latest iPhones, as well as Samsung Fast Charge. The MP-A11 reference design was defined and developed by NXP, and is already used in many leading transmitter solutions for mobile devices. The MP-A11 offers a best-in-class charging and safety experience, and is currently the only proven development solution in the market to enable fast wireless charging optimized for iPhone.

The current approved MP-A11 reference desig…


NXP Speeds IoT and Edge Development with 64-bit Processing in a Palm-Sized System

Small form-factor FRWY-LS1012A with mikroBUS™ Click Module and Ubuntu Userland expands development for hundreds of applications
NXP Semiconductors™ N.V. (NASDAQ: NXPI), a worldwide leader in advanced secure connectivity solutions, today announced the Freeway board for the Layerscape® LS1012A Communication SoC. The FRWY-LS1012A provides a low-cost development platform packed with connectivity options for quick product prototyping. The built-in mikroBUS Click module on the Freeway board provides easy expansion through hundreds of powerful click modules supporting sensors, actuators, memories and displays.

LS1012A delivers higher packet throughput with its onboard packet for…


NXP Unveils Cutting Edge IoT, Industrial and Automotive Solutions at Embedded World 2018


NXP invites VIP guests and media to an innovative IoT Edge Compute Experience, a comprehensive and personalized edge-computing and artificial intelligence (AI) demonstration
NXP booth to highlight latest IoT technologies for smart home and industrial applications as well as the new Greenbox development platform for electric vehicles

NUREMBERG, Germany, Feb. 20, 2018 (GLOBE NEWSWIRE) — (Embedded World 2018) – Human interaction with smart devices and services has become an integral part of life. From home automation to manufacturing, medicine and transport, people rely on secure, smart connections. NXP Semiconductors N.V. (NASDAQ:NXPI), an embedded semiconductor leader…


NXP GreenBox Development Platform Accelerates Transition to Hybrid and Electric Vehicles (HEVs/EVs)  

High-performance processing platform used to design and test control algorithms and energy management tasks for next-generation electric drive vehicles
NUREMBERG, Germany, Feb. 20, 2018 (GLOBE NEWSWIRE) — NXP Semiconductors N.V. (NASDAQ:NXPI), has announced the availability of its GreenBox vehicle electrification development platform. GreenBox allows automakers and suppliers to begin early development of next-generation hybrid and electric vehicle applications on NXP’s S32 automotive processing multicore platform based on Arm Cortex technology.

With increasing regulatory restrictions on emissions and stricter fuel economy targets around the world, both traditional automakers and new ma…


NXP and Partners Sign Joint Charter on Cybersecurity

Call for dedicated government ministries and chief information security officers
Independent certification for critical infrastructures and solutions in the Internet of Things
Nine partners present first charter on cybersecurity at Munich Security Conference

MUNICH, Germany, Feb. 16, 2018 (GLOBE NEWSWIRE) —  At the Munich Security Conference today, NXP Semiconductors™ N.V. (NASDAQ:NXPI) and eight key partners from the industry will sign the first joint charter for greater cybersecurity. Initiated by Siemens, the Charter of Trust calls for binding rules and standards to build trust in cybersecurity and further advance digitalization. In addition to NXP, Siemens and the Munich Secu…