カテゴリー別アーカイブ: GLOBALFOUNDRIES

RT @SEMIexpos: Wafers to Wall St – Changing Investor Perceptions, Growing Trends in Semiconductors. 2018 predicted to be another terrific year! ICs are forecast to be up 8% and #semiconductor equipment up 11%. Register now! http://bit.ly/2FikIEb pic.twitter.com/SvPUyyoO6Y

RT : Wafers to Wall St – Changing Investor Perceptions, Growing Trends in Semiconductors. 2018 predicted to be another terrific year! ICs are forecast to be up 8% and equipment up 11%. Register now! http://bit.ly/2FikIEb 

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The advantages of eFPGA in cost, power consumption, performance, and board complexity are substantial, and it will be interesting to see what kinds of apps become the “sweet spot” for eFPGA adoption. Read more from @QuickLogic_Corp http://ow.ly/5lMl30hXxPh 

The advantages of eFPGA in cost, power consumption, performance, and board complexity are substantial, and it will be interesting to see what kinds of apps become the “sweet spot” for eFPGA adoption. Read more from http://ow.ly/5lMl30hXxPh 

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RT @asegroup_global: GLOBALFOUNDRIES #3D expert, Luke England, describes the increasing levels of #integration related to 3D technology and why this requires strong and reliable supply chain partners, such as asegroup. #SiP #semiconductor #ecosystempic.twitter.com/k685c7VzsY

RT : GLOBALFOUNDRIES expert, Luke England, describes the increasing levels of related to 3D technology and why this requires strong and reliable supply chain partners, such as asegroup.

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Awesome NEWS to be announced next week for The ConFab 2018 in May!! Stay tuned to see who will be adding to the great speaker line-up so far, that already includes top experts from GOOGLE, IBM, GLOBALFOUNDRIES, NVIDIA, QUALCOMM….. Wait for it! http://www.theconfab.com 

Awesome NEWS to be announced next week for The ConFab 2018 in May!! Stay tuned to see who will be adding to the great speaker line-up so far, that already includes top experts from GOOGLE, IBM, GLOBALFOUNDRIES, NVIDIA, QUALCOMM….. Wait for it! http://www.theconfab.com 

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RT @Cimetrix: Don't miss Alan Weber's joint presentation, "Device Scaling vs. Process Control Scaling: Advanced Sensorization Closes the Gap" with André Holfeld of GF tomorrow at 9:30am at the 15th innovationsforum for automation in Dresden. #INNO18pic.twitter.com/Q9xYxDnfnf

RT : Don’t miss Alan Weber’s joint presentation, “Device Scaling vs. Process Control Scaling: Advanced Sensorization Closes the Gap” with André Holfeld of GF tomorrow at 9:30am at the 15th innovationsforum for automation in Dresden.

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Technologies and trends impacting the future of semiconductor manufacturing and design. Serious issues – Serious insights – Serious discussions. At The ConFab 2018 this May. http://www.theconfab.com pic.twitter.com/R2ubnp160l

Technologies and trends impacting the future of semiconductor manufacturing and design. Serious issues – Serious insights – Serious discussions. At The ConFab 2018 this May. http://www.theconfab.com 

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RT @EverspinTech: “Our 256Mb STT-MRAM is the first perpendicular MTJ STT- MRAM entering mass production… both a testament to the technical strength of Everspin as well as the joint productization strength provided by the collaboration with GF,”pic.twitter.com/36RfCsZ7Ko

RT : “Our 256Mb STT-MRAM is the first perpendicular MTJ STT- MRAM entering mass production… both a testament to the technical strength of Everspin as well as the joint productization strength provided by the collaboration with GF,”

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