NXP and Metanoia Collaborate on Broadband Access Solutions

Layerscape® Platform Demonstration Showcases xDSL CPE use case in Broadband World Forum
BERLIN, Oct. 24, 2017 (GLOBE NEWSWIRE) — (BROADBAND WORLD FORUM 2017) — NXP Semiconductors N.V. (NASDAQ:NXPI) and Metanoia Communications, today announced that Metanoia’s proven ADSL2/2+, VDSL2 and G.fast (referred to collectively as “xDSL”) technology will be demonstrated with NXP’s innovative Layerscape portfolio. The technology collaboration will deliver next generation broadband access solutions for home and carrier gateways, xDSL Central Office systems and standalone xDSL termination such as SFP modules.  

Major consumer trends driving the need for this technology are the continued growth of i…


NXP Unveils Breakthrough Innovations for Payment Cards

New fingerprint-on-card solution and world benchmark on payment card transaction speeds, <200 ms

LAS VEGAS, Oct. 19, 2017 (GLOBE NEWSWIRE) — (MONEY 20/20 2017) — NXP Semiconductors N.V. (NASDAQ:NXPI) today debuted two significant technology breakthroughs at the largest fintech innovation event, Money 20/20, October 22-25, 2017, in Las Vegas. The company will showcase its new contactless fingerprint-on-card solution while also demonstrating a new world benchmark for payment card transactions speeds.

Fingerprint Sensors on Payment Cards
The fingerprint-on-card solution gives payment network operators and banks a secure, convenient and fast payment card option to consumers…


NXP Revolutionizes ID Security and Durability with World’s Thinnest Contactless Chip Module

Company’s new MOB10 contactless chip module transforms how passports and identity cards are designed while adding more security layers and features
News Highlights:

NXP is the first in the market to offer a contactless chip module with a thickness of <200 µm, representing the world’s thinnest contactless chip module available in high-volume
MOB10 supports polycarbonate technology to add additional security layers and features on the identity document while maintaining document robustness.
MOB10 builds on the proven MOB industry platform enabling a smooth transition without additional production investment

EINDHOVEN, The Netherlands, Oct. 17, 2017 (GLOBE NEWSWIRE) — NXP S…


NXP Announces New Automotive Processing Platform that Brings Future Vehicles to Market Faster

8 of the top 15 car makers have already adopted NXP S32 platform for upcoming models

NXP S32 Auto Processing Platform Image

10x the performance of today’s best performing safe automotive platform1
Reduces software development effort by 90 percent within application domains, and by more than 40 percent across application domains.2
Delivers new levels of automotive safety, security and Over-the-Air (OTA) capabilities

SAN JOSE, Calif., Oct. 16,…


NXP, Telco Systems, and Arm Introduce New uCPE Offering

Companies collaborate to address market requirement for multi-technology and multi-vendor uCPE white box options MANSFIELD, MA and AUSTIN, TX October 10, 2017 — NXP Semiconductors (NASDAQ: NXPI), a worldwide leader in secure connectivity solutions and Telco Systems, the leading provider of innovative SDN/NFV, CE 2.0, MPLS and IP solutions, together announced the industry’s first Arm®-based uCPE solution available in the market. In close collaboration with Arm, the solution combines a rich uCPE feature set on a multicore communications platform in the LS2088A that enables a performance, power and cost point not available in the market with existing a…


NXP® Unveils Highest Performance Layerscape® Networking and Data Center Offload System-on-Chip Solution

Sixteen high-performance Arm® 64-bit cores, advanced acceleration and 100 Gbit/s Ethernet in low-power FinFET process technology
SAN JOSE, Calif., Oct. 04, 2017 (GLOBE NEWSWIRE) — LINLEY PROCESSOR CONFERENCE — NXP Semiconductors N.V. (NASDAQ:NXPI), a worldwide leader in advanced secure connectivity solutions, today announced the highest performance member of the Layerscape family, the LX2160A SoC. The LX2160A is specifically designed to enable challenging high-performance network applications, network edge compute, and data center offloads. Trusted and secure execution of virtualized cloud workloads at the edge is driving new distributed computing paradigms. 

The LX2160A features sixt…


NXP Semiconductors Announces the Timing of the Release of Third Quarter 2017 Results

EINDHOVEN, The Netherlands, Oct. 03, 2017 (GLOBE NEWSWIRE) — NXP Semiconductors N.V. (NASDAQ:NXPI) today announced it will release its third quarter 2017 financial results after the close of extended trading on the NASDAQ Global Select Market on Wednesday, October 25, 2017 EDT.

NXP will not hold an earnings call nor provide forward guidance for the fourth quarter of 2017 due to the pending acquisition of NXP by Qualcomm.
About NXP Semiconductors
NXP Semiconductors N.V. (NASDAQ:NXPI) enables secure connections and infrastructure for a smarter world, advancing solutions that make lives easier, better and safer. As the world leader in secure connectivity solutions for embedded application…


NXP Announces the Industry’s First Comprehensive, Secure, Smart Energy Dual-band Solution for Smart Homes and Cities

As a Zigbee Smart Energy v1.4 Golden Unit candidate, this dual-band solution meets growing demand for smart meters and systems to monitor utility usage and reduce overall global carbon footprint LONDON, UNITED KINGDOM, October 3, 2017 – NXP Semiconductors (NASDAQ: NXPI), a world leader in secure connectivity solutions for embedded applications, today announced it has combined its industry-leading wireless MCU with best-in-class processing and security technology to help accelerate development of smart energy products and systems for secure smart homes and buildings. As an industry first in this space, NXP is also honored to have been selected as a …


NXP Leverages Google’s Cloud IoT Core to Enable Smart Devices for Edge Computing

NXP brings expertise in security, processing and digital networking for developer community to drive IoT edge intelligence in Google Cloud IoT Core
SAN JOSE, Calif., Sept. 27, 2017 (GLOBE NEWSWIRE) — As an early partner for Android Things, NXP Semiconductors N.V. (NASDAQ:NXPI) today announced support for the public beta of Google Cloud IoT Core, a fully managed service on Google Cloud Platform (GCP) to securely connect and manage IoT devices at scale. Cloud IoT Core is now publicly available to all users in beta, including new features and pricing plan.

By bringing together the latest advancements in security, processing, and digital networking, and NXP technologies help meet the compl…


NXP Introduces iOS 11 Toolkit to Expand iPhone NFC Capabilities into the IoT

EINDHOVEN, The Netherlands, Sept. 21, 2017 (GLOBE NEWSWIRE) — NXP Semiconductors N.V. (NASDAQ:NXPI), co-inventor of NFC technology, today introduced a new toolkit for NFC tagging ICs with iOS support, which unlocks the potential to now connect billions of consumer and industrial products to the Internet of Things (IoT). With Apple®’s announcement, earlier this summer, to support NFC read capabilities for NFC Forum-compliant tags, NXP’s portfolio of advanced NFC tagging chips can now be designed into solutions used with iOS 11 on iPhone® 7, iPhone 7 Plus, iPhone 8, iPhone 8 Plus and iPhone X models. To accelerate and simplify development, NXP offers iOS developers a full tool suite of NFC …


NXP Launches New Java Card-based Operating System to Expand Multi-Application Services in the Secure Identification Market

Next generation Java Card OS (JCOP) provides higher security and more flexibility for developing and integrating convergence solutions covering identity and payment on smart cards News Highlights :
Advanced Java Card™ Platform (JCOP3) builds upon NXP’s 15 years of leadership and expertise in secure Java Card operating system technology that supports the convergence of eGovernment, payment and mobility applications on a single device New product offers more flexibility to work with 3rd party applets and allows native functionalities through NXP’s unique SecureBox solution Includes extended featur…


NXP S32V Processor for Vision and Machine Learning Applications Now Available

S32V processor enhanced with Vision SDK and expanded ecosystem enablement partners Offers powerful GPU for surround view image stitching and offloads advanced vision processing and machine learning algorithms to APEX-2 engines Robust sensor fusion solution with multiple layers of functional safety and security High-performance per power envelope (GHz/mW) for low power ADAS vision processing, for adding additional capabilities within the same system environmentAUSTIN, TEXAS Sept.13, 2017 – NXP Semiconductors (NASDAQ:NXPI) today announced the full availability of the NXP S32V processor along with complementary S32 Design Studio IDE enablement to simplify and accelerate the deployment of ADAS v…


NXP Launches World’s First Scalable, Single-Chip Secure Vehicle-to-X Platform

New DSRC/802.11p solution “sees” around corners to deliver a safe and secure autonomous driving experience Builds on NXP’s leadership in delivering industry’s first complete 5.9 GHz secure V2X solution, now in vehicle productionFRANKFURT, Sept. 12, 2017 – NXP Semiconductors N.V. (NASDAQ:NXPI), the world’s largest supplier of automotive semiconductor solutions, has expanded its leadership in secure vehicle-to-everything communications (V2X) with its next generation RoadLINK™ solution. The new NXP SAF5400 is the world’s first automotive qualified, high-performance single-chip DSRC modem. Its unique scalable architecture, new industry-leading security features, and leading edge RFCMOS and softw…


HELLA Aglaia and NXP Reveal Open Vision Platform for Safe Autonomous Driving

Unique three-pillar concept: scalable, functionally safe, AI readyOpen approach allows the combination of the industry’s best sensor and software technologies for all levels of automated driving FRANKFURT, Sept. 12, 2017 – HELLA Aglaia and NXP are expanding their current ADAS car vision platform with artificial intelligence (AI) capability in 2018. HELLA Aglaia’s ADAS platforms include NXP’s S32 and i.MX auto-grade processors, enabling a safe, scalable and complete range of front vision NCAP functionality, allowing OEMs to deploy in the volume car segment. The next step in the cooperation is to add artificial intelligence for automated driving to this innovative modular setup. This will offe…


NXP Introduces Its Smallest 8-bit S08 Microcontroller Yet for Broad Market

The new 3 x 3 x 0.9 mm S08 MCU package from NXP further extends its S08 MCU portfolio to satisfy the broad market need for a tiny 8-bit MCUNXP Semiconductors today announced its smallest 8-bit S08 microcontroller (MCU) – the MC9S08PA4AVDC microcontroller. Measuring just 3 x 3 x 0.9 mm, this new package helps address the growing challenge of shrinking PCB space for tomorrow’s technologies, without increasing BOM costs. The MC9S08PA4AVDC can be used in various size-limited applications such as industrial control, BLDC motor control and Internet-of-Things (IoT) control that requires a tiny MCU.The MC9S08PA4AVDC MCU joins NXP’s low-cost, high-performance HCS08 family of 8-bit microcontrollers….


NXP and Changan Automobile to Cooperate on Infotainment and Future Vehicle Technologies

EINDHOVEN, Netherlands, Aug. 30, 2017 (GLOBE NEWSWIRE) — NXP Semiconductors (NASDAQ:NXPI) today announced that it has entered into a Strategic Cooperation Framework Agreement (“Agreement”) with Changan Automobile. Headquartered in Chongqing, China, Changan Automobile is one of China’s largest car manufacturers and the first Chinese company to achieve long-distance self-driving. The long-term partnership is a multiphase engagement. The first phase is focused on excellence in infotainment, products, solutions and the development of industry standards for future vehicle semiconductors. In the second phase of the partnership, Changan will apply NXP’s Vehicle-to-x (V2X) communication, Near Fie…


NXP Powers Event Passes for 150,000 Athletes, Government Officials and Delegates at the International 29th Summer Universiade

MIFARE Ultralight Nano contactless entrance passes provide a more convenient experience for secure access to sports venues and ceremonies at international sports event
TAIPEI, Taiwan, Aug. 17, 2017 (GLOBE NEWSWIRE) — NXP Semiconductors N.V. (NASDAQ:NXPI) is the official supplier of the smart ticketing solution for the 29th Summer Universiade in Taipei, one the world’s top international sporting events where university student athletes from all over the world compete in 17 categories. NXP’s MIFARE Ultralight Nano, a contactless smart paper ticketing IC, is powering the technology used in the entrance passes for the 150,000 athletes, government officials, university leaders, VIP guests, de…


NXP Semiconductors Reports Second Quarter 2017 Results

Q2 2017 Revenue $2.202 billion GAAP Gross margin 49.2 % GAAP Operating margin 2.3 %     Non-GAAP Gross margin 53.0 % Non-GAAP Operating margin           28.4 %
EINDHOVEN, The Netherlands, Aug. 02, 2017 (GLOBE NEWSWIRE) — NXP Semiconductors N.V. (NASDAQ:NXPI) today reported financial results for the second quarter ended July 2, 2017.  “NXP delivered good seasonal results for the second quarter of 2017, with revenue of $2.20 billion, a decline of 7 percent year on year, and flat versus the prior quarter, with both the annual and quarterly period comparisons impacted by the successful divestment of our Standard Products business in early February. HPMS segment revenue was $2.1 b…


NXP and Amazon Web Services Launch Cooperation in IoT

NXP Intelligent Gateway Platform completes integration of Amazon Web Services Greengrass providing secure and efficient support for edge computing and IoT Cloud
EINDHOVEN, Netherlands, July 27, 2017 (GLOBE NEWSWIRE) — NXP Semiconductors N.V. (NASDAQ:NXPI) today announced it is working with Amazon Web Services (AWS), to successfully complete the integration of Amazon Greengrass on its Layerscape Intelligent Gateway platform. Amazon Greengrass is a software that extends AWS Cloud capabilities to local devices, making it possible for them to collect and analyze data closer to the source of information, while also securely communicating with each other on local networks. This integration pro…


NXP Announces Executive Management Transition

EINDHOVEN, Netherlands, July 24, 2017 (GLOBE NEWSWIRE) — NXP Semiconductors N.V. (NASDAQ:NXPI) announced today that, effective August 6, 2017, Chief Financial Officer Daniel Durn is leaving the company to become the Chief Financial Officer of Applied Materials, Inc. 

“I would like to express my deep gratitude to Dan for playing an invaluable role in driving the significant financial improvement of NXP during his tenure. Furthermore, I’d like to thank him for his intense focus and drive which directly resulted in NXP realizing a substantially improved cost and capital structure. His leadership has been a key contributor of the successful integration of Freescale, and directly positioned …


NXP Announces Production of Security Chips in its US Manufacturing Facilities

Multimillion-dollar expansion program will complete the re-shoring of an end-to-end US supply chain for manufacturing secure identification chips used in US Government applications
AUSTIN, Texas and CHANDLER, Ariz., July 20, 2017 (GLOBE NEWSWIRE) — NXP Semiconductors N.V. (NASDAQ:NXPI) today announced a $22 million dollar program that expands its operations in the United States, enabling the Company’s US facilities to manufacture security chips for government applications that can support critical US national and homeland security programs. Upon completion of the expansion project, NXP facilities in Austin and Chandler will be certified to manufacture finished products that exceed the hi…


NXP Identifies Top Global Trends in RFID for the Retail Market – Speaks at RAIN RFID Alliance Meeting in Seattle

RAIN RFID and NFC to boost shopping experiences and smarten up product handling by retailers in brick and mortar
SEATTLE and EINDHOVEN, Netherlands, July 19, 2017 (GLOBE NEWSWIRE) — While the on-demand economy has led to many brick-and-mortar stores declining, omnichannel services continue to grow. Smart supply chain management with advanced tracking and monitoring capabilities enabled by RAIN (Radio frequency IdentificatioN) RFID support both, short and extended range communication, are empowering retailers to address a multitude of new use cases. In combination with consumer-to-goods interaction through NFC (Near Field Communication) tags are increasingly adopted as key elements of con…


NXP Semiconductors Announces the Timing of the Release of Second Quarter 2017 Results

EINDHOVEN, The Netherlands, July 11, 2017 (GLOBE NEWSWIRE) — NXP Semiconductors N.V. (NASDAQ:NXPI) today announced it will release its second quarter 2017 financial results after the close of extended trading on the NASDAQ Global Select Market on Wednesday, August 2, 2017.

NXP will not hold an earnings call nor provide forward guidance for the third quarter of 2017 due to the pending acquisition of NXP by Qualcomm.
About NXP Semiconductors
NXP Semiconductors N.V. (NASDAQ:NXPI) enables secure connections and infrastructure for a smarter world, advancing solutions that make lives easier, better and safer. As the world leader in secure connectivity solutions for embedded applications, NXP…


NXP and Widex Bring Industry’s Most Power-efficient, Wireless Audio Streaming Hearing Aids to Market

EINDHOVEN, Netherlands and COPENHAGEN, Denmark, July 06, 2017 (GLOBE NEWSWIRE) — NXP Semiconductors (NASDAQ:NXPI) and Widex, one of the world’s leading hearing aid producers, announced that they have collaborated to develop, test and integrate NXP’s NxH2003 Bluetooth Low Energy (BLE) audio streaming SoC into Widex BEYOND™ hearing aids. The two companies worked closely together throughout the product development cycle, merging the best of hearing aid engineering and wireless audio streaming semiconductor technology, to deliver hearing aid devices that can stream wireless audio from an iOS device, consuming only 2.8 mA current at 1.2 Volts, which is best in industry. This allows end users t…


NXP Brings Better Fan Experience to 2017 FIFA Confederations Cup with Secure Contactless Ticketing and Communication

Company’s MIFARE-based contactless ticket technology delights fans with convenience, secure access and event information on NFC-enabled mobile devices
EINDHOVEN, Netherlands, June 29, 2017 (GLOBE NEWSWIRE) — As the 2017 FIFA Confederations Cup heads into the championship game, thousands of fans attending this world-class football event also enjoyed convenient and secure access to Russia’s spectacular stadiums with NXP-enabled contactless smart-card technology. Thanks to NXP MIFARE product technology in the electronic tickets for the event, fans had quick, secure stadium access to the matches.

NXP is the leader in contactless smart card technology for international sporting events aroun…


NXP Expands its Software Solutions for MPC56 and MPC57 MCUs Based on Power Architecture Technology

AUTOSAR MCAL and Operating System software for the MPC56xx devices are now free-of-charge NXP has radically reduced the price for AUTOSAR MCAL and Operating System for the MPC57xx microcontrollers reaffirming its long-term commitment to Power Architecture Production-grade Software Development Kit (SDK), middleware and stacks now available as an early access release for the MPC57xxAUTSIN, TEXAS – June 27, 2017 – Developers of electronic controls for industrial and automotive products face a steep challenge to bring products to market fast with enhanced safety and security features. This complexity in automotive software development led the industry to develop the AUTOSAR standard, a…


NXP Unveils Next Generation Security Platform that Protects Citizen Identity and Private Information in the Digital Services Era 

News Highlights:

3rd generation SmartMX platform delivers the highest security for eGovernment, payment, and access management applications where protection of personal identifiable information (PII), financial information and private data are paramount.   
Building upon NXP’s 15 years expertise in designing security microprocessors, the future-proof platform serves high-volume applications and supports new trends in the electronic credentials market.
NXP´s customers will benefit from the platform’s performance and flexibility, and the new architecture helps customers accelerate time to market for new products.

EINDHOVEN, Netherlands, June 27, 2017 (GLOBE NEWS…


NXP, Shanghai Unicom and roam2free Collaborate to Develop Secure eSIM Solution That Provides More Freedom and Convenience for Mobile Phone Users in China

Complete solution combines mobile payment and ticketing with GSMA-compliant remote SIM activation for consumers to quickly add mobile subscriptions and cellular networks to their smartphones for better coverage and when traveling abroad
SHANGHAI, China, June 26, 2017 (GLOBE NEWSWIRE) — MWC SHANGHAI — NXP Semiconductors N.V. (NASDAQ:NXPI) collaborates with Shanghai Unicom, one of the first pilot units in “consumer networking” of China Unicom, and roam2free to develop a secure eSIM solution that makes it easy for consumers to add mobile plans and cellular networks to their smartphone. For the ultimate consumer experience, the solution provides convenient mobile payment and ticketing while…


NXP Broadens the LPC546xx Family of MCUs as It Achieves Volume Production

Product Highlights Now offering up to 220 MHz performance while retaining power-efficiency as low as 100 uA / MHz Compatible CAN-FD kit and shield (OM13094 board, available in July) along with in drivers and example code Scalable package offering, which includes TFBGA180, TFBGA100, LQFP208, and LQFP100 packagesSAN JOSE, CALIFORNIA – June 21, 2017 – NXP Semiconductors N.V. (NASDAQ:NXPI), leading innovator and microcontroller manufacturer to the mass market, significantly expands the availability of its LPC546xx family of MCUs.
The LPC546xx family of ARM® Cortex®-M4 based microcontrollers, introduced earlier this year, recently shifted into volume production, and together with NX…